Chiplet technology is on the rise
Although the idea of chiplets has existed for decades, chiplet-based packaging is driving new types of components, products, and systems for specialized applications. Some believe the future of chip innovation lies in moving to modular designs based on “chiplet” building blocks, essentially moving from system-on-chip (SoC) to System-on-Package (SoP) chip architectures. So, when will this happen? What are the benefits? And what will spur adoption? We talk about that, and more in this webinar with moderator, Brian Bailey (SemiEngineering), and panelists Nick Ilyadis (Achronix), Rich Wawrzyniak (Semico), and Bapi Vinnakota (ODSA).
